Global Unichip tapes out 64G UCIe IP on TSMC N3P process, enabling high bandwidth for AI and HPC chiplet designs.
This tape-out on TSMC's cutting-edge N3P process gives GUC a competitive advantage in the high-growth AI and HPC chiplet market. By offering a high-performance, reliable UCIe IP, GUC can capture demand from system designers building next-generation accelerators and processors, solidifying its position as a critical enabler of the chiplet ecosystem.
GUC successfully taped out its 64G UCIe IP on TSMC's N3P process
The IP delivers 21 Tbps/mm bandwidth density for AI and HPC applications
Features include bridges for AXI, CXS, and CHI buses and integrated reliability monitors
Features include bridges for AXI, CXS, and CHI buses and integrated reliability monitors
GUC successfully taped out its 64G UCIe IP on TSMC's N3P process
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